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The most common culprit. The PCB laminate (typically FR-4 with a CTE of 14-17 ppm/°C in-plane and 50-70 ppm/°C through-thickness) expands and contracts at a different rate than the ceramic or silicon component (CTE of 2.6-6 ppm/°C). Every power cycle induces shear stress on the SPAD. After thousands of cycles, fatigue cracks nucleate at the pad corner.